LG Electronics and SK Enmove Collaborate on Thermal Management for AI Data Centers

LG Electronics has signed a memorandum of understanding (MOU) with SK Enmove to collaborate on the development of next-generation refrigerants and thermal management materials specifically designed for AI data centers.

This partnership aims to enhance the performance and efficiency of cooling systems, particularly in light of increasing regulations surrounding refrigerants' global warming potential. The companies plan to develop eco-friendly refrigerants with a global warming potential (GWP) below 150, free from harmful substances.

LG Electronics will utilize its HVAC expertise, while SK Enmove will contribute its experience in refrigerant development. Together, they will also explore immersion cooling technology, which involves submerging servers in non-conductive fluids to improve heat dissipation in AI data centers.

Lee Jae-sung, president of LG Electronics' ES Business Division, emphasized the importance of this collaboration in strengthening their competitive edge in the global market. The partnership is expected to pave the way for further advancements in thermal management solutions across various industries.